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TDC joins hands with CIEC to hold two new trade fairs

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(From left to right, front row) Managing Director of CIEC Exhibition Co. (HK) Ltd., Mr Xie Sen Shu, President of CIEC Group Corporation, Mr Liang Wen, Assistant Executive Director of TDC, Mr Benjamin Chau and Senior Manager, Exhibitions of TDC, Mr Patrick Wong at the signing ceremony.
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President of CIEC Group Corporation, Mr Liang Wen and Assistant Executive Director of TDC, Mr Benjamin Chau exchanged the signed agreements.

The Trade Development Council (TDC) and the CIEC Exhibition Company (Hong Kong) Limited have joined forces to stage two new trade fairs in Hong Kong next year.

The events are the Hong Kong International Printing & Packaging Fair and the Hong Kong International Building Materials and Construction Equipment Fair, which will be held at the AsiaWorldExpo at Chek Lap Kok Airport in April and October, 2006 respectively.

CIEC Exhibition Co (Hong Kong ) is a subsidiary of China International Exhibition Centre Group based on the mainland, run under the direction of China Council for the Promotion of International Trade (CCPIT).

The Group organises and hosts international trade shows and conventions, and since its inception in 1985, has organised more than 800 exhibitions on the mainland.

Under their agreement signed last month, the TDC and the CIEC Exhibition Co (Hong Kong) will solicit buyers and exhibitors to the two shows separately from different parts of the world.

Although taking place for the first time, the two fairs are tipped to attract large crowds because of the current strong market demand for their products.

The two fairs are among the eight new exhibitions to be staged in Hong Kong next year by the TDC in collaboration with other Hong Kong exhibition organisers as announced last month (for details, please refer to the press release at this link: http://www.tdctrade.com/tdcnews/0504/05041101.htm).

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Content provided by Hong Kong Trade Development Council